Please use this identifier to cite or link to this item: http://repository.psa.edu.my/handle/123456789/2444
Title: MACHINE PROCESS CONDITION MONITORING WITH 3MP
Authors: MAZNAH ILLIYAS AHMAD
YUSRI YUSOF
ANBIA ADAM
MOHD ELIAS DAUD
Keywords: Machining process
Condition monitoring
WSN
sensor
Issue Date: 2019
Publisher: IEEE
Abstract: Recently, machine process domain is archiving significant advancement in term of sensing technology. The technology has a powerful impact on enabling self -monitoring and results in high quality of final product. The aim of this paper is to propose a new method on machine process condition monitoring by 3MP. 3MP (Modern Machine Monitoring Process) works wirelessly to integrate between machine, computer and 6 type of sensory device.
URI: http://repository.psa.edu.my/handle/123456789/2444
Appears in Collections:Conference Paper

Files in This Item:
File Description SizeFormat 
MACHINE PROCESS CONDITION MONITORING WITH 3MP.pdf536.04 kBAdobe PDFView/Open


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.