MACHINE PROCESS CONDITION MONITORING WITH 3MP

Please use this identifier to cite or link to this item: http://repository.psa.edu.my/handle/123456789/2444

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DC Field	Value	Language
dc.contributor.author	MAZNAH ILLIYAS AHMAD	-
dc.contributor.author	YUSRI YUSOF	-
dc.contributor.author	ANBIA ADAM	-
dc.contributor.author	MOHD ELIAS DAUD	-
dc.date.accessioned	2020-12-31T15:30:18Z	-
dc.date.available	2020-12-31T15:30:18Z	-
dc.date.issued	2019	-
dc.identifier.uri	http://repository.psa.edu.my/handle/123456789/2444	-
dc.description.abstract	Recently, machine process domain is archiving significant advancement in term of sensing technology. The technology has a powerful impact on enabling self -monitoring and results in high quality of final product. The aim of this paper is to propose a new method on machine process condition monitoring by 3MP. 3MP (Modern Machine Monitoring Process) works wirelessly to integrate between machine, computer and 6 type of sensory device.	en_US
dc.language.iso	en	en_US
dc.publisher	IEEE	en_US
dc.subject	Machining process	en_US
dc.subject	Condition monitoring	en_US
dc.subject	WSN	en_US
dc.subject	sensor	en_US
dc.title	MACHINE PROCESS CONDITION MONITORING WITH 3MP	en_US
dc.type	Article	en_US
Appears in Collections:	Conference Paper

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